4JET's TOPAZ G
SMART WINDOW PATTERNING
High Speed Patterning for Smart Window Manufacturing
Our TOPAZ G is a tailor-made system for layer-side structuring of TCO electrodes on Smart Windows with high throughput and very high resolution.
Managing a tight focus
First of all, it is important to mention that the Smart Window glass pane to be laser structured has a length of more than 3 m, but its thickness is only about 1 mm. An even greater challenge to the patterning process is the fact that the structure width to be produced is sometimes less than 10 µm, with a total tolerance of less than 2 µm over this large glass pane. This is the only way to ensure that the pattern is invisible to the human eye. As a result of this structure width, the theoretical depth of focus of the laser beam at a spot size of 10 µm (1/e²) is less than 150 µm.
To meet these challenges, the glass pane is fixed on a large, flat granite table. In addition, the topology of the granite table is determined and the focus of each patterning head is adjusted accordingly during patterning.
This ensures long-term stable structuring conditions for a sustainable quality of the final product. Remember, the final product is a window and the human eye is not easily fooled.
The Heart of the TOPAZ G
Two aspects accomplish the required throughput of the TOPAZ G, one is parallelization, the other one is scanning on-the-fly. Parallel scanning is accomplished with of 5 single patterning heads. All of them extremely well calibrated in their own working area as well as with regard to each other and the linear axis system. Scanning on-the-fly means the laser beam is deflected at high speed by a 2D scanner while the axis system moves the patterning head. This mode of operation achieves an unmatched throughput compared to standard step-and-repeat approaches.
Accuracy and throughput at the next level for a scalable and economical smart window production. The TOPAZ G – a benchmark for large area patterning.
Specification
Thin-films | transparent conductive oxides (e.g. ITO, FTO and othes), active layers |
Patterning resolution | < 10 µm |
Processing | ablative patterning from the film side |
Scanning on-the-fly | Yes, based on up to 5 parallel scanning heads |
Substrate dimensions | 1.500 x 3.050 mm² |
glass thickness | around 1 mm |
Working area (x, y) | Identical to substrate dimensions |
Axis speed | up to 500 mm/s |
Position Accuracy within temperature range 22 ± 2C° | +/- 15 µm |
Particle extraction | yes |
MES interface | yes |
Footprint | 3.000 m x 4.700 m |
Weight | approx. 14 t |
Loading and unloading | automatic |
Contact
We look forward to your questions – our experts are at your disposal.